SASTRA hosts Indo-Taiwan conference on chip packaging, testing

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A two-day Indo-Taiwan league connected semiconductor packaging and investigating was organised by SASTRA Deemed University successful relation with Lunghwa University of Science and Technology, with enactment from the SPARC strategy of the Ministry of Education, Government of India, recently.

A property merchandise said Rao. R. Tummala, advisor to India Semiconductor Mission, highlighted the planetary modulation from System-on-Chip (SoC) to System-on-Package (SoP) and discussed his proven exemplary of establishing Industry Co-development Centres (ICCs) worldwide, which helium is present moving to replicate successful India to enactment the maturation of its semiconductor industry.

S. Vaidhyasubramaniam, vice-chancellor, SASTRA deemed university, underscored the university’s ongoing world and probe collaborations with Taiwanese institutions, noting that specified partnerships are important for strengthening India’s semiconductor capabilities.

Experts from the semiconductor manufacture and academia successful India and Taiwan addressed the conference, which saw the information of much than 140 delegates representing 20 industries and 25 world institutions.

On the occasion, a Memorandum of Understanding (MoU) was signed betwixt SASTRA deemed assemblage and PTW Semiconductor India Pvt. Ltd to foster industry-academia collaboration, the merchandise said.

Po-Hsueh Chang of the Department of Semiconductor Engineering, Lunghwa University of Science and Technology; Venkatesh Kumar Pandurengan, General Manager, PTW Semiconductor India Pvt. Ltd, and R. John Bosco Balaguru of SASTRA Deemed University were present.

Published - February 01, 2026 05:55 p.m. IST

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